Items where Author is "Wietstruck, M."

Article

Stocchi, M. and Mencarelli, D. and Pierantoni, L. and Kot, D. and Lisker, M. and Göritz, A. and Kaynak, C. Baristiran and Wietstruck, M. and Kaynak, Mehmet (2019) Mid-infrared optical characterization of thin SiNx membranes. Applied Optics, 58 (19). pp. 5233-5239. ISSN 1559-128X (Print) 2155-3165 (Online)

Barıştıran Kaynak, Canan and Yamamoto, Yuji and Goeritz, A. and Korndoerfer, F. and Zaumseil, P. and Kulse, P. and Schulz, K. and Wietstruck, M. and Shafique, Atia and Gürbüz, Yaşar and Kaynak, Mehmet (2018) High performance thermistor based on Si1-xGex/Si multi quantum wells. IEEE Electron Device Letters, 39 (5). pp. 753-756. ISSN 0741-3106 (Print) 1558-0563 (Online)

Papers in Conference Proceedings

Stocchi, M. and Wietstruck, M. and Schulze, S. and Zhibo, C. and Tolunay, S. and Kaynak, Mehmet (2020) Full-wave RF modeling of a fan-out wafer-level packaging technology based on Al-Al wafer bonding. In: IEEE 20th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF), San Antonio, TX, USA

Kaynak, C. Baristiran and Goeritz, A. and Durmaz, E. C. and Wietstruck, M. and Onat, Ege and Özcan, Ali Şah and Türkoğlu, Enes Recep and Gürbüz, Yaşar and Kaynak, M. (2020) Thermo-mechanical modeling and experimental validation of an uncooled microbolometer. In: IEEE 20th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF), San Antonio, TX, USA

Kaynak, C. B. and Goritz, A. and Yamamoto, Y. and Wietstruck, M. and Stocchi, M. and Ünal, Kadir Eren and Özdemir, Mehmet Bora and Özsoy, Yusuf and Gürbüz, Yaşar and Kaynak, Mehmet (2019) Mechanical and thermal modeling of an uncooled microbolometer. In: European Microwave Conference in Central Europe (EuMCE), Prague, Czech Republic

Kaynak, Canan B. and Goeritz, A. and Yamamoto, Y. and Trusch, A. and Stocchi, M. and Wietstruck, M. and Ünal, Kadir Eren and Özdemir, Mehmet Bora and Özsoy, Yusuf and Gürbüz, Yaşar and Kaynak, Mehmet (2019) FEM modeling of microbolometer structures. In: MikroSystemTechnik 2019; Congress, Berlin, Germany

Kaynak, C. Baristiran and Yamamoto, Y. and Goeritz, A. and Korndoerfer, F. and Stocchi, M. and Wietstruck, M. and Gürbüz, Yaşar and Kaynak, M. (2019) Process effects on the noise performance of SiGe/Si multi quantum well thermistor. In: 2nd Joint International Technology and Device Meeting, ISTDM 2019 / International Conference on Silicon Epitaxy and Heterostructures, ICSI 2019 Conference, Madison, WI, USA

Wietstruck, M. and Schulze, S. and Rebhan, B. and Kerepesi, P. and Kurz, H. and Silberer, G. and Meiler, J. and Tolunay Wipf, S. and Wipf, C. and Kaynak, Mehmet (2019) Al-Al direct bonding with sub-μm alignment accuracy for millimeter wave SiGe BiCMOS wafer level packaging and heterogeneous integration. In: IEEE 69th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA

Baristiran-Kaynak, Canan and Göritz, A. and Yamamoto, Y. and Wietstruck, M. and Stocchi, M. and Ünal, Kadir Eren and Özdemir, Mehmet Bora and Özsoy, Yusuf and Gürbüz, Yaşar and Kaynak, Mehmet (2019) Development and mechanical modeling of Si1-XGex/Si MQW based uncooled microbolometers in a 130 nm BiCMOS. In: 19th IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF), Orlando, FL, USA

Wietstruck, M. and Marschmeyer, S. and Tolunay Wipf, S. and Wipf, C. and Voß, T. and Bertrand, M. and Pistono, E. and Acri, G. and Podevin, F. and Ferrari, P. and Kaynak, Mehmet (2018) Design optimization of through-silicon vias for substrate-integrated waveguides embedded in high-resistive silicon interposer. In: IEEE 20th Electronics Packaging Technology Conference (EPTC), Singapore

Baristiran Kaynak, C. and Yamamoto, Y. and Göritz, A. and Korndörfer, F. and Zaumseil, P. and Kulse, P. and Schulz, K. and Fraschke, M. and Marschmeyer, S. and Wolansky, D. and Wietstruck, M. and Shafique, Atia and Gürbüz, Yaşar and Kaynak, Mehmet (2018) Si1-xGex/Si MQW based uncooled microbolometer development and integration into 130 nm BiCMOS technology. In: 8th Symposium on SiGe, Ge, and Related Compounds: Materials, Processing, and Devices - AiMES 2018, ECS and SMEQ Joint International Meeting, Cancun, Mexico

Kaynak, C. Baristiran and Yamamoto, Y. and Göritz, A. and Korndörfera, F. and Zaumseil, P. and Kulse, P. and Schulz, K. and Wietstruck, M. and Costina, I. and Shafique, Atia and Gürbüz, Yaşar and Kaynak, Mehmet (2018) Pixel resistance optimization of a Si0.5Ge0.5/Si MQWs thermistor based on in-situ B doping for microbolometer applications. In: Infrared Technology and Applications XLIV 2018, Orlando, FL, USA

Inac, M. and Wietstruck, M. and Goritz, A. and Cetindogan, B. and Baristiran-Kaynak, C. and Lisker, M. and Kruger, A. and Trusch, A. and Saarow, U. and Heinrich, P. and Voss, T. and Kaynak, Mehmet (2018) Oxide surface roughness optimization of BiCMOS beol wafers for 200 mm wafer level microfluidic packaging based on fusion bonding. In: IEEE 19th Electronics Packaging Technology Conference (EPTC), Singapore

Wietstruck, M. and Marschmeyer, S. and Lisker, M. and Kruger, A. and Wolansky, D. and Fraschke, M. and Kulse, P. and Goritz, A. and Inac, M. and Voss, T. and Mai, A. and Kaynak, Mehmet (2018) Through-Silicon Via process module with backside metallization and redistribution layer within a 130 nm SiGe BiCMOS technology. In: IEEE 19th Electronics Packaging Technology Conference (EPTC), Singapore

Wietstruck, M. and Marschmeyer, S. and Voß, T. and Inac, M. and Lisker, M. and Krüger, A. and Wolansky, D. and Kulse, P. and Schulz, K. and Katzer, J. and Göritz, A. and Mai, A. and Kaynak, Mehmet (2017) 200 mm silicon wafer with buried 3D etchstop layer for flexible-sized via-middle tsvs in a CMOS/BiCMOS technology (200 mm silizium wafer mit vergrabenen 3D-atzstoppschichten für flexible via-middle TSVs in CMOS/BiCMOS technologien). In: MikroSystemTechnik Kongress 2017: MEMS, Mikroelektronik, Systeme - MikroSystemTechnik Conference 2017: MEMS, Microelectronics, Systems, Munchen

Tolunay Wipf, S. and Göritz, A. and Wietstruck, M. and Wipf, C. and Kaynak, Mehmet (2017) BiCMOS embedded RF-MEMS technologies (BiCMOS-integrierte HF-MEMS-technologien). In: MikroSystemTechnik Kongress 2017: MEMS, Mikroelektronik, Systeme - MikroSystemTechnik Conference 2017: MEMS, Microelectronics, Systems, Munchen

Wipf, S. Tolunay and Goritz, A. and Wietstruck, M. and Cirillo, M. and Wipf, C. and Winkler, W. and Kaynak, Mehmet (2017) Packaged BiCMOS embedded RF-MEMS test vehicles for space applications. In: 47th European Microwave Conference (EuMC), Nuremburg, Germany

Göritz, A. and Tolunay Wipf, S. and Wietstruck, M. and Mai, A. and Kaynak, Mehmet (2017) Process control for thin film encapsulation of BiCMOS RF-MEMS switches by means of the BEOL-integrated Pirani element (Prozesskontrolle für die dünnschichtverkapselung von BiCMOS HF-MEMS-schaltern mittels BEOL-integriertem Pirani-element). In: MikroSystemTechnik Kongress 2017: MEMS, Mikroelektronik, Systeme - MikroSystemTechnik Conference 2017: MEMS, Microelectronics, Systems, Munchen

Wietstruck, M. and Kaynak, M. and Marschmeyer, M. and Wipf, C. and Tekin, İbrahim and Zoschke, K. and Tillack, B. (2013) Modeling and optimization of BiCMOS embedded through-silicon vias for RF-grounding. In: SIRF 2014, (Accepted)