Thermo-mechanical modeling and experimental validation of an uncooled microbolometer

Kaynak, C. Baristiran and Goeritz, A. and Durmaz, E. C. and Wietstruck, M. and Onat, Ege and Özcan, Ali Şah and Türkoğlu, Enes Recep and Gürbüz, Yaşar and Kaynak, M. (2020) Thermo-mechanical modeling and experimental validation of an uncooled microbolometer. In: IEEE 20th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF), San Antonio, TX, USA

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This paper presents mechanical and thermal modeling of a microbolometer using finite element modeling in ANSYS. The considered design of microbolometer is modeled, fabricated and measured. The deformations on the arm structure of the microbolometer are measured and compared with the developed model. Additionally, the measurements for mechanical deformations over 8-inch wafer are used to identify the effect of the process variations on the final device. The measured deformation distribution is correlated with the varied thickness of the bottom Si3N4 layer of the arm structure. Finally, the ANSYS models are utilized in order to extract thermal characterization properties of the microbolometer design, namely thermal conductance and the time constant.
Item Type: Papers in Conference Proceedings
Uncontrolled Keywords: Bolometers; finite element analysis; infrared imaging; modeling; stress control
Divisions: Faculty of Engineering and Natural Sciences
Depositing User: Yaşar Gürbüz
Date Deposited: 30 Jul 2023 14:26
Last Modified: 30 Jul 2023 14:26

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