Inac, M. and Wietstruck, M. and Goritz, A. and Cetindogan, B. and Baristiran-Kaynak, C. and Lisker, M. and Kruger, A. and Trusch, A. and Saarow, U. and Heinrich, P. and Voss, T. and Kaynak, Mehmet (2018) Oxide surface roughness optimization of BiCMOS beol wafers for 200 mm wafer level microfluidic packaging based on fusion bonding. In: IEEE 19th Electronics Packaging Technology Conference (EPTC), Singapore
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Official URL: https://dx.doi.org/10.1109/EPTC.2017.8277523
Abstract
200 mm wafer level microfluidic packaging is developed by low temperature oxide-oxide fusion bonding. The requirement for high quality fusion bonding is to have less than 1 nm microroughness on the wafer surfaces. An optimization process of the oxide deposition and planarization is done on the wafer surfaces. It is achieved to lower the microroughness from 2.08 nm to 0.4 nm without backside processes on the BiCMOS wafer and to 0.615 nm with backside processes on the BiCMOS processes after optimization.
| Item Type: | Papers in Conference Proceedings |
|---|---|
| Divisions: | Faculty of Engineering and Natural Sciences |
| Depositing User: | Mehmet Kaynak |
| Date Deposited: | 03 Jun 2023 19:57 |
| Last Modified: | 03 Jun 2023 19:57 |
| URI: | https://research.sabanciuniv.edu/id/eprint/45829 |
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