Items where Author is "Inac, M."

Papers in Conference Proceedings

Inac, M. and Wietstruck, M. and Goritz, A. and Cetindogan, B. and Baristiran-Kaynak, C. and Lisker, M. and Kruger, A. and Trusch, A. and Saarow, U. and Heinrich, P. and Voss, T. and Kaynak, Mehmet (2018) Oxide surface roughness optimization of BiCMOS beol wafers for 200 mm wafer level microfluidic packaging based on fusion bonding. In: IEEE 19th Electronics Packaging Technology Conference (EPTC), Singapore

Wietstruck, M. and Marschmeyer, S. and Lisker, M. and Kruger, A. and Wolansky, D. and Fraschke, M. and Kulse, P. and Goritz, A. and Inac, M. and Voss, T. and Mai, A. and Kaynak, Mehmet (2018) Through-Silicon Via process module with backside metallization and redistribution layer within a 130 nm SiGe BiCMOS technology. In: IEEE 19th Electronics Packaging Technology Conference (EPTC), Singapore

Wietstruck, M. and Marschmeyer, S. and Voß, T. and Inac, M. and Lisker, M. and Krüger, A. and Wolansky, D. and Kulse, P. and Schulz, K. and Katzer, J. and Göritz, A. and Mai, A. and Kaynak, Mehmet (2017) 200 mm silicon wafer with buried 3D etchstop layer for flexible-sized via-middle tsvs in a CMOS/BiCMOS technology (200 mm silizium wafer mit vergrabenen 3D-atzstoppschichten für flexible via-middle TSVs in CMOS/BiCMOS technologien). In: MikroSystemTechnik Kongress 2017: MEMS, Mikroelektronik, Systeme - MikroSystemTechnik Conference 2017: MEMS, Microelectronics, Systems, Munchen