Items where Author is "Wietstruck, Matthias"

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Number of items: 11.

Article

Cao, Zhibo and Goritz, Alexander and Stocchi, Matteo and Wietstruck, Matthias and Hoyer, Christian and Steinweg, Luca David and Carta, Corrado and Ellinger, Frank and Tillack, Bernd and Kaynak, Mehmet (2022) An advanced finite element model for BiCMOS process oriented ultra-thin wafer deformation. IEEE Transactions on Semiconductor Manufacturing, 35 (1). pp. 2-10. ISSN 0894-6507 (Print) 1558-2345 (Online)

Papers in Conference Proceedings

Cao, Zhibo and Stocchi, Matteo and Wietstruck, Matthias and Garbuglia, Federico and Pincini, Diego and Kaynak, Mehmet (2020) Advanced thermal modeling of IC - package interaction. In: IEEE Radio and Wireless Symposium (RWS), San Antonio, TX, USA

Krüger, Patrick and Wietstruck, Matthias and Kissinger, Gudrun and Lisker, Marco and Krüger, Andreas and Döhler, T. and Schäffner, Jan and Silz, Heike and Geißler, U. and Kaynak, Mehmet (2019) Development of a shear force measurement for qualitatively analyzation and optimization of wafer bonding processes [Entwicklung einer scherkraftmessung zur qualitativen analyse und optimierung von wafer bonding prozessen]. In: MikroSystemTechnik Kongress 2019: Mikroelektronik, MEMS-MOEMS, Systemintegration - Saulen der Digitalisierung und kunstlichen Intelligenz - MikroSystemTechnik Congress 2019: Microelectronics, MEMS-MOEMS, System Integration - Pillars of Digitization and Ar, Berlin

Wietstruck, Matthias and Marschmeyer, Steffen and Schulze, Sebastian and Kaynak, Mehmet (2019) SiGe BiCMOS technology with embedded through-silicon vias and interposer fan-out wafer-level packaging platform. In: 2019 European Microwave Conference in Central Europe, EuMCE 2019, Prague

Cao, Zhibo and Göritz, Alexander and Wietstruck, Matthias and Wipf, Selin Tolunay and Trusch, Andreas and Kaynak, Mehmet (2019) Finite-element modelling of stress induced wafer warpage for a full BiCMOS process. In: IEEE 19th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF), Orlando, FL, USA

Schulze, Sebastian and Wietstruck, Matthias and Fraschke, Mirko and Kerepesi, Peter and Kurz, Helmut and Rebhan, Bernhard and Kaynak, Mehmet (2019) Optimization of a BEOL aluminum deposition process enabling wafer level Al-Al thermo-compression bonding. In: IEEE 69th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA

Wietstruck, Matthias and Marschmeyer, Steffen and Kulse, Philipp and Vob, Thomas and Lisker, Marco and Krüger, Andreas and Wolansky, Dirk and Fraschke, Mirko and Kaynak, Mehmet (2018) Development of a through-silicon via (TSV) process module for multi-project wafer SiGe BiCMOS and silicon interposer. In: IEEE 68th Electronic Components and Technology Conference (ECTC), San Diego, CA, USA

Çetindoğan, Barbaros and Üstündağ, Berktuğ and Türkmen, Eşref and Wietstruck, Matthias and Kaynak, Mehmet and Gürbüz, Yaşar (2018) A d-band SPDT switch utilizing reverse-saturated SiGe HBTs for dicke-radiometers. In: 11th German Microwave Conference (GeMiC), Freiburg, Germany

Çetindoğan, Barbaros and Üstündağ, Berktuğ and Burak, Abdurrahman and Wietstruck, Matthias and Kaynak, Mehmet and Gürbüz, Yaşar (2018) A 5-13 GHz 6-Bit vector-sum phase shifter with+3.5 dBm IP1dB in 0.25-mu m SiGe BiCMOS. In: IEEE Asia Pacific Microwave Conference (APMC), Kuala Lumpur, Malaysia

Kaynak, Mehmet and Wietstruck, Matthias and Göritz, Alexander and Wipf, Selin Tolunay and İnaç, Mesut and Çetindoğan, Barbaros and Wipf, Christian and Kaynak, Canan Baristiran and Wöhrmann, Markus and Voges, Steve and Braun, Tanja (2017) 0.13-μm SiGe BiCMOS technology with More-than-Moore modules. In: IEEE Bipolar/BiCMOS Circuits and Technology Meeting (BCTM 2017), Miami, FL, USA

Wipf, Selin Tolunay and Göritz, Alexander and Wipf, Christian and Wietstruck, Matthias and Burak, Abdurrahman and Türkmen, Eşref and Gürbüz, Yaşar and Kaynak, Mehmet (2017) 240 GHz RF-MEMS switch in a 0.13 μm SiGe BiCMOS technology. In: IEEE Bipolar/BiCMOS Circuits and Technology Meeting (BCTM 2017), Miami, FL, USA

This list was generated on Wed Apr 17 05:05:23 2024 +03.