Cao, Zhibo and Stocchi, Matteo and Wietstruck, Matthias and Garbuglia, Federico and Pincini, Diego and Kaynak, Mehmet (2020) Advanced thermal modeling of IC - package interaction. In: IEEE Radio and Wireless Symposium (RWS), San Antonio, TX, USA
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Official URL: https://dx.doi.org/10.1109/RWS45077.2020.9050057
Abstract
A layout based finite element thermal convection model including detailed board tracing and packaging information is developed. A state-of-art 0.13-μm SiGe BiCMOS chip with embedded poly-resistors and thermal diodes are used as experimental validations of thermal modelling results. The designated thermal model demonstrates a high accuracy of less than 1.5 Celsius deviation from experimental results. And the layout based automatic generation of model geometry drastically reduces time consumption during model development and, moreover, paves the way for modelling of packages which possess even higher complexities.
| Item Type: | Papers in Conference Proceedings |
|---|---|
| Uncontrolled Keywords: | ANSYS; COMSOL; convection; finite element method; thermal |
| Divisions: | Faculty of Engineering and Natural Sciences |
| Depositing User: | Mehmet Kaynak |
| Date Deposited: | 30 Jul 2023 14:35 |
| Last Modified: | 30 Jul 2023 14:35 |
| URI: | https://research.sabanciuniv.edu/id/eprint/46510 |
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