Items where Author is "Wipf, C."

Wietstruck, M. and Schulze, S. and Rebhan, B. and Kerepesi, P. and Kurz, H. and Silberer, G. and Meiler, J. and Tolunay Wipf, S. and Wipf, C. and Kaynak, Mehmet (2019) Al-Al direct bonding with sub-μm alignment accuracy for millimeter wave SiGe BiCMOS wafer level packaging and heterogeneous integration. In: IEEE 69th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA

Wipf, C. and Sorge, R. and Wipf, S. Tolunay and Göritz, A. and Scheit, A. and Kissinger, D. and Kaynak, Mehmet (2019) RF-MEMS based v-band impedance tuner driven by integrated high-voltage LDMOS switch matrix and charge pump. In: IEEE 19th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF), Orlando, FL, USA

Wietstruck, M. and Marschmeyer, S. and Tolunay Wipf, S. and Wipf, C. and Voß, T. and Bertrand, M. and Pistono, E. and Acri, G. and Podevin, F. and Ferrari, P. and Kaynak, Mehmet (2018) Design optimization of through-silicon vias for substrate-integrated waveguides embedded in high-resistive silicon interposer. In: IEEE 20th Electronics Packaging Technology Conference (EPTC), Singapore

Wipf, C. and Sorge, R. and Göritz, A. and Wipf, S. Tolunay and Scheit, A. and Kissinger, D. and Kaynak, Mehmet (2018) High voltage LDMOS inverter for on-chip RF-MEMS actuation. In: IEEE 18th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF), Anaheim, CA, USA

Wietstruck, M. and Kaynak, M. and Marschmeyer, M. and Wipf, C. and Tekin, İbrahim and Zoschke, K. and Tillack, B. (2013) Modeling and optimization of BiCMOS embedded through-silicon vias for RF-grounding. In: SIRF 2014, (Accepted)

Kaynak, Mehmet and Ehwald, K. E. and Scholz, Rene and Korndörfer, F. and Wipf, C. and Sun, Y. M. and Tillack, B. and Zihir, Samet and Gürbüz, Yaşar (2010) Characterization of an embedded RF-MEMS switch. In: Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF 2010), New Orleans, LA