Items where Author is "Voß, T."

Wietstruck, M. and Marschmeyer, S. and Tolunay Wipf, S. and Wipf, C. and Voß, T. and Bertrand, M. and Pistono, E. and Acri, G. and Podevin, F. and Ferrari, P. and Kaynak, Mehmet (2018) Design optimization of through-silicon vias for substrate-integrated waveguides embedded in high-resistive silicon interposer. In: IEEE 20th Electronics Packaging Technology Conference (EPTC), Singapore

Inac, M. and Wietstruck, M. and Goritz, A. and Cetindogan, B. and Baristiran-Kaynak, C. and Lisker, M. and Kruger, A. and Trusch, A. and Saarow, U. and Heinrich, P. and Voss, T. and Kaynak, Mehmet (2018) Oxide surface roughness optimization of BiCMOS beol wafers for 200 mm wafer level microfluidic packaging based on fusion bonding. In: IEEE 19th Electronics Packaging Technology Conference (EPTC), Singapore

Wietstruck, M. and Marschmeyer, S. and Lisker, M. and Kruger, A. and Wolansky, D. and Fraschke, M. and Kulse, P. and Goritz, A. and Inac, M. and Voss, T. and Mai, A. and Kaynak, Mehmet (2018) Through-Silicon Via process module with backside metallization and redistribution layer within a 130 nm SiGe BiCMOS technology. In: IEEE 19th Electronics Packaging Technology Conference (EPTC), Singapore