Items where Author is "Mai, A."

Papers in Conference Proceedings

Baristiran Kaynak, C. and Yamamoto, Y. and Göritz, A. and Korndörfer, F. and Zaumseil, P. and Kulse, P. and Schulz, K. and Fraschke, M. and Marschmeyer, S. and Wolansky, D. and Wietstruck, M. and Shafique, Atia and Gürbüz, Yaşar and Kaynak, Mehmet (2018) Si1-xGex/Si MQW based uncooled microbolometer development and integration into 130 nm BiCMOS technology. In: 8th Symposium on SiGe, Ge, and Related Compounds: Materials, Processing, and Devices - AiMES 2018, ECS and SMEQ Joint International Meeting, Cancun, Mexico

Wietstruck, M. and Marschmeyer, S. and Lisker, M. and Kruger, A. and Wolansky, D. and Fraschke, M. and Kulse, P. and Goritz, A. and Inac, M. and Voss, T. and Mai, A. and Kaynak, Mehmet (2018) Through-Silicon Via process module with backside metallization and redistribution layer within a 130 nm SiGe BiCMOS technology. In: IEEE 19th Electronics Packaging Technology Conference (EPTC), Singapore

Wietstruck, M. and Marschmeyer, S. and Voß, T. and Inac, M. and Lisker, M. and Krüger, A. and Wolansky, D. and Kulse, P. and Schulz, K. and Katzer, J. and Göritz, A. and Mai, A. and Kaynak, Mehmet (2017) 200 mm silicon wafer with buried 3D etchstop layer for flexible-sized via-middle tsvs in a CMOS/BiCMOS technology (200 mm silizium wafer mit vergrabenen 3D-atzstoppschichten für flexible via-middle TSVs in CMOS/BiCMOS technologien). In: MikroSystemTechnik Kongress 2017: MEMS, Mikroelektronik, Systeme - MikroSystemTechnik Conference 2017: MEMS, Microelectronics, Systems, Munchen

Göritz, A. and Tolunay Wipf, S. and Wietstruck, M. and Mai, A. and Kaynak, Mehmet (2017) Process control for thin film encapsulation of BiCMOS RF-MEMS switches by means of the BEOL-integrated Pirani element (Prozesskontrolle für die dünnschichtverkapselung von BiCMOS HF-MEMS-schaltern mittels BEOL-integriertem Pirani-element). In: MikroSystemTechnik Kongress 2017: MEMS, Mikroelektronik, Systeme - MikroSystemTechnik Conference 2017: MEMS, Microelectronics, Systems, Munchen

Wietstruck, Matthias and Kaynak, Mehmet and Mai, Andreas (2017) SiGe BiCMOS heterogeneous integration using wafer bonding technologies. In: 10th Symposium on Semiconductor Process Integration - 232nd ECS Meeting, National Harbor, MD, USA