Wietstruck, M. and Kaynak, M. and Marschmeyer, M. and Wipf, C. and Tekin, İbrahim and Zoschke, K. and Tillack, B. (2013) Modeling and optimization of BiCMOS embedded through-silicon vias for RF-grounding. In: SIRF 2014, (Accepted/In Press)
Wietstruck_SiRF2014.pdf
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| Item Type: | Papers in Conference Proceedings |
|---|---|
| Subjects: | T Technology > TK Electrical engineering. Electronics Nuclear engineering > TK7800-8360 Electronics |
| Divisions: | Faculty of Engineering and Natural Sciences > Academic programs > Electronics Faculty of Engineering and Natural Sciences |
| Depositing User: | İbrahim Tekin |
| Date Deposited: | 16 Jan 2014 12:44 |
| Last Modified: | 26 Apr 2022 09:12 |
| URI: | https://research.sabanciuniv.edu/id/eprint/22573 |


