Modeling and optimization of BiCMOS embedded through-silicon vias for RF-grounding

Wietstruck, M. and Kaynak, M. and Marschmeyer, M. and Wipf, C. and Tekin, İbrahim and Zoschke, K. and Tillack, B. (2013) Modeling and optimization of BiCMOS embedded through-silicon vias for RF-grounding. In: SIRF 2014, (Accepted/In Press)

Item Type:	Papers in Conference Proceedings
Subjects:	T Technology > TK Electrical engineering. Electronics Nuclear engineering > TK7800-8360 Electronics
Divisions:	Faculty of Engineering and Natural Sciences > Academic programs > Electronics Faculty of Engineering and Natural Sciences
Depositing User:	İbrahim Tekin
Date Deposited:	16 Jan 2014 12:44
Last Modified:	26 Apr 2022 09:12
URI:	https://research.sabanciuniv.edu/id/eprint/22573

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