Items where Author is "Schulze, Sebastian"

Papers in Conference Proceedings

Wietstruck, Matthias and Marschmeyer, Steffen and Schulze, Sebastian and Kaynak, Mehmet (2019) SiGe BiCMOS technology with embedded through-silicon vias and interposer fan-out wafer-level packaging platform. In: 2019 European Microwave Conference in Central Europe, EuMCE 2019, Prague

Schulze, Sebastian and Wietstruck, Matthias and Fraschke, Mirko and Kerepesi, Peter and Kurz, Helmut and Rebhan, Bernhard and Kaynak, Mehmet (2019) Optimization of a BEOL aluminum deposition process enabling wafer level Al-Al thermo-compression bonding. In: IEEE 69th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA