Items where Author is "Kulse, Philipp"
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Wietstruck, Matthias and Marschmeyer, Steffen and Kulse, Philipp and Vob, Thomas and Lisker, Marco and Krüger, Andreas and Wolansky, Dirk and Fraschke, Mirko and Kaynak, Mehmet (2018) Development of a through-silicon via (TSV) process module for multi-project wafer SiGe BiCMOS and silicon interposer. In: IEEE 68th Electronic Components and Technology Conference (ECTC), San Diego, CA, USA