Items where Author is "Katzer, J."

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Papers in Conference Proceedings

Wietstruck, M. and Marschmeyer, S. and Voß, T. and Inac, M. and Lisker, M. and Krüger, A. and Wolansky, D. and Kulse, P. and Schulz, K. and Katzer, J. and Göritz, A. and Mai, A. and Kaynak, Mehmet (2017) 200 mm silicon wafer with buried 3D etchstop layer for flexible-sized via-middle tsvs in a CMOS/BiCMOS technology (200 mm silizium wafer mit vergrabenen 3D-atzstoppschichten für flexible via-middle TSVs in CMOS/BiCMOS technologien). In: MikroSystemTechnik Kongress 2017: MEMS, Mikroelektronik, Systeme - MikroSystemTechnik Conference 2017: MEMS, Microelectronics, Systems, Munchen

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