Krüger, Patrick and Wietstruck, Matthias and Kissinger, Gudrun and Lisker, Marco and Krüger, Andreas and Döhler, T. and Schäffner, Jan and Silz, Heike and Geißler, U. and Kaynak, Mehmet (2019) Development of a shear force measurement for qualitatively analyzation and optimization of wafer bonding processes [Entwicklung einer scherkraftmessung zur qualitativen analyse und optimierung von wafer bonding prozessen]. In: MikroSystemTechnik Kongress 2019: Mikroelektronik, MEMS-MOEMS, Systemintegration - Saulen der Digitalisierung und kunstlichen Intelligenz - MikroSystemTechnik Congress 2019: Microelectronics, MEMS-MOEMS, System Integration - Pillars of Digitization and Ar, Berlin
Full text not available from this repository. (Request a copy)Abstract
In this work it is shown that shear force measurements are a great method to assess wafer bonds. Different approaches to prepare the measurement structures are shown and discussed. The establishing of standardised shear force measurement structures allows a systematic investigation of wafer bonding processes and the optimization of every relevant process and bonding parameter. The established methods are not restricted to plasma activated fusion bonding but can be used for various permanent bonding methods.
| Item Type: | Papers in Conference Proceedings |
|---|---|
| Divisions: | Faculty of Engineering and Natural Sciences > Academic programs > Electronics Faculty of Engineering and Natural Sciences |
| Depositing User: | Mehmet Kaynak |
| Date Deposited: | 08 Aug 2023 11:12 |
| Last Modified: | 08 Aug 2023 11:12 |
| URI: | https://research.sabanciuniv.edu/id/eprint/46939 |
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