Wietstruck, M. and Marschmeyer, S. and Tolunay Wipf, S. and Wipf, C. and Voß, T. and Bertrand, M. and Pistono, E. and Acri, G. and Podevin, F. and Ferrari, P. and Kaynak, Mehmet (2018) Design optimization of through-silicon vias for substrate-integrated waveguides embedded in high-resistive silicon interposer. In: IEEE 20th Electronics Packaging Technology Conference (EPTC), Singapore
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Official URL: https://dx.doi.org/10.1109/EPTC.2018.8654426
Abstract
In this work, the optimization of TSVs for SIWs embedded in a high-resistive silicon interposer is demonstrated. EM simulations are performed to analyze and optimize important TSV design parameters enabling silicon interposer technologies with low-loss SIWs working at mm-wave/THz frequencies. A silicon interposer using high resistive silicon and TSVs is fabricated and SIWs are characterized working from 110-170 GHz with very low attenuation of ~0.5 dB/mm.
| Item Type: | Papers in Conference Proceedings |
|---|---|
| Divisions: | Faculty of Engineering and Natural Sciences > Academic programs > Electronics Faculty of Engineering and Natural Sciences |
| Depositing User: | Mehmet Kaynak |
| Date Deposited: | 04 Aug 2023 13:05 |
| Last Modified: | 04 Aug 2023 13:05 |
| URI: | https://research.sabanciuniv.edu/id/eprint/46883 |
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