TSV antennas for multi-band wireless communication

Warning The system is temporarily closed to updates for reporting purpose.

Pano, Vasil and Tekin, İbrahim and Yılmaz, Işıkcan and Liu, Yuqiao and Dandekar, Kapil R. and Taşkın, Barış (2020) TSV antennas for multi-band wireless communication. IEEE Journal on Emerging and Selected Topics in Circuits and Systems (SI), 10 (1). pp. 100-113. ISSN 2156-3357 (Print) 2156-3365 (Online)

[thumbnail of 09000620.pdf] PDF
09000620.pdf
Restricted to Registered users only

Download (6MB) | Request a copy

Abstract

On-chip wireless links offer improved network performance due to long distance communication, additional bandwidth, and broadcasting capabilities of antennas. This work challenges the on-chip antenna design conventions, and pushes toward a Through-Silicon Via-based antenna design called TSV_A that establishes multi-band wireless communication through the silicon substrate medium with only a 3 dB loss over a 30mm on-chip distance. The TSV_A performance is evaluated in both Finite Element Method and system-level Network-on-Chip (NoC) simulations. A comparison to traditional wire-based NoCs, analysis of wireless multi-bands, and technology scaling to demonstrate the substantial area improvements compared to traditional wireless NoCs (up to 99.88%) are performed. Simulation results show an improvement in network latency up to similar to 13% (average improvement of similar to 7%), energy-delay improvements of similar to 34% on average, and an improvement in throughput up to similar to 34% (average improvement of similar to 23%), using Wireless NoC with multi-band TSV_As. The improved signal performance of TSV_A, and multi-band capabilities, are ideal for wireless intercell communication for programmable metasurfaces with dedicated communication layers.
Item Type: Article
Uncontrolled Keywords: Network-on-chip; on-chip antenna; wireless interconnect; multi-band; tsv
Subjects: T Technology > TK Electrical engineering. Electronics Nuclear engineering > TK7800-8360 Electronics
Divisions: Faculty of Engineering and Natural Sciences > Academic programs > Electronics
Faculty of Engineering and Natural Sciences
Depositing User: İbrahim Tekin
Date Deposited: 05 Sep 2020 09:40
Last Modified: 26 Apr 2022 10:17
URI: https://research.sabanciuniv.edu/id/eprint/40216

Actions (login required)

View Item
View Item