Pano, Vasil and Tekin, İbrahim and Yılmaz, Işıkcan and Liu, Yuqiao and Dandekar, Kapil R. and Taşkın, Barış (2020) TSV antennas for multi-band wireless communication. IEEE Journal on Emerging and Selected Topics in Circuits and Systems (SI), 10 (1). pp. 100-113. ISSN 2156-3357 (Print) 2156-3365 (Online)
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Official URL: http://dx.doi.org/10.1109/JETCAS.2020.2974236
Abstract
On-chip wireless links offer improved network performance due to long distance communication, additional bandwidth, and broadcasting capabilities of antennas. This work challenges the on-chip antenna design conventions, and pushes toward a Through-Silicon Via-based antenna design called TSV_A that establishes multi-band wireless communication through the silicon substrate medium with only a 3 dB loss over a 30mm on-chip distance. The TSV_A performance is evaluated in both Finite Element Method and system-level Network-on-Chip (NoC) simulations. A comparison to traditional wire-based NoCs, analysis of wireless multi-bands, and technology scaling to demonstrate the substantial area improvements compared to traditional wireless NoCs (up to 99.88%) are performed. Simulation results show an improvement in network latency up to similar to 13% (average improvement of similar to 7%), energy-delay improvements of similar to 34% on average, and an improvement in throughput up to similar to 34% (average improvement of similar to 23%), using Wireless NoC with multi-band TSV_As. The improved signal performance of TSV_A, and multi-band capabilities, are ideal for wireless intercell communication for programmable metasurfaces with dedicated communication layers.
Item Type: | Article |
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Uncontrolled Keywords: | Network-on-chip; on-chip antenna; wireless interconnect; multi-band; tsv |
Subjects: | T Technology > TK Electrical engineering. Electronics Nuclear engineering > TK7800-8360 Electronics |
Divisions: | Faculty of Engineering and Natural Sciences > Academic programs > Electronics Faculty of Engineering and Natural Sciences |
Depositing User: | İbrahim Tekin |
Date Deposited: | 05 Sep 2020 09:40 |
Last Modified: | 29 Jul 2023 22:32 |
URI: | https://research.sabanciuniv.edu/id/eprint/40216 |