In-package wireless communication with TSV-based antenna

Pano, Vasil and Tekin, İbrahim and Liu, Yuqiao and Dandekar, Kapil R. and Taşkın, Barış (2019) In-package wireless communication with TSV-based antenna. In: IEEE International Symposium on Circuits and Systems (ISCAS 2019), Sapporo, Japan

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Network-on-Chip (NoC) has been shown to be the most viable alternative to an interconnect bus for the scalability of the system [1]. On-chip antennas, implementing wireless interconnects, are introduced for improved scalability of NoCs in [2]. On-chip wireless links offer improved network performance due to long distance communication, additional bandwidth, and broadcasting capabilities of antennas. The most prominent on-chip antenna designs are the planar logperiodic and meander which have a surface-propagation of the EM waves of the antenna. The main detriment of these antennas, and surface-propagation in general, is the poor signal attenuation (i.e. path loss) even at small distances of 5mm. This work challenges the on-chip antenna design conventions, and pushes toward a Through-Silicon Via (TSV)- based antenna design called TSV_A that establishes wireless communication through the silicon substrate medium with only a 3 dB loss over a 30mm on-chip distance.
Item Type: Papers in Conference Proceedings
Subjects: T Technology > TK Electrical engineering. Electronics Nuclear engineering > TK7800-8360 Electronics
Divisions: Faculty of Engineering and Natural Sciences > Academic programs > Electronics
Faculty of Engineering and Natural Sciences
Depositing User: İbrahim Tekin
Date Deposited: 26 Aug 2019 15:43
Last Modified: 26 Apr 2022 09:32

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