Pano, Vasil and Tekin, İbrahim and Liu, Yuqiao and Dandekar, Kapil R. and Taşkın, Barış (2019) In-package wireless communication with TSV-based antenna. In: IEEE International Symposium on Circuits and Systems (ISCAS 2019), Sapporo, Japan
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Abstract
Network-on-Chip (NoC) has been shown to be the most
viable alternative to an interconnect bus for the scalability
of the system [1]. On-chip antennas, implementing wireless
interconnects, are introduced for improved scalability of
NoCs in [2]. On-chip wireless links offer improved network
performance due to long distance communication, additional
bandwidth, and broadcasting capabilities of antennas. The
most prominent on-chip antenna designs are the planar logperiodic
and meander which have a surface-propagation of
the EM waves of the antenna. The main detriment of these
antennas, and surface-propagation in general, is the poor
signal attenuation (i.e. path loss) even at small distances
of 5mm. This work challenges the on-chip antenna design
conventions, and pushes toward a Through-Silicon Via (TSV)-
based antenna design called TSV_A that establishes wireless
communication through the silicon substrate medium with
only a 3 dB loss over a 30mm on-chip distance.
Item Type: | Papers in Conference Proceedings |
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Subjects: | T Technology > TK Electrical engineering. Electronics Nuclear engineering > TK7800-8360 Electronics |
Divisions: | Faculty of Engineering and Natural Sciences > Academic programs > Electronics Faculty of Engineering and Natural Sciences |
Depositing User: | İbrahim Tekin |
Date Deposited: | 26 Aug 2019 15:43 |
Last Modified: | 26 Apr 2022 09:32 |
URI: | https://research.sabanciuniv.edu/id/eprint/37207 |