PMMA-based wafer-bonded capacitive micromachined ultrasonic transducer for underwater applications

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Ahmad, Mansoor and Bozkurt, Ayhan and Farhanieh, Omid (2019) PMMA-based wafer-bonded capacitive micromachined ultrasonic transducer for underwater applications. Micromachines, 10 (5). ISSN 2072-666X

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Official URL: http://dx.doi.org/10.3390/mi10050319


This article presents a new wafer-bonding fabrication technique for Capacitive Micromachined Ultrasonic Transducers (CMUTs) using polymethyl methacrylate (PMMA). The PMMA-based single-mask and single-dry-etch step-bonding device is much simpler, and reduces process steps and cost as compared to other wafer-bonding methods and sacrificial-layer processes. A low-temperature (<180 ◦ C) bonding process was carried out in a purpose-built bonding tool to minimize the involvement of expensive laboratory equipment. A single-element CMUT comprising 16 cells of 2.5 mm radius and 800 nm cavity was fabricated. The center frequency of the device was set to 200 kHz for underwater communication purposes. Characterization of the device was carried out in immersion, and results were subsequently validated with data from Finite Element Analysis (FEA). Results show the feasibility of the fabricated CMUTs as receivers for underwater applications.

Item Type:Article
Uncontrolled Keywords:Capacitive Micromachined Ultrasonic Transducers (CMUTs); wafer bonding; PMMA; underwater acoustics; Microelectromechanical Systems (MEMS)
Subjects:T Technology > T Technology (General) > T174.7 Nanotechnology
ID Code:37700
Deposited By:Mansoor Ahmad
Deposited On:24 Aug 2019 12:15
Last Modified:24 Aug 2019 12:15

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