title   
  

Modeling and optimization of BiCMOS embedded through-silicon vias for RF-grounding

Wietstruck, M. and Kaynak, M. and Marschmeyer, M. and Wipf, C. and Tekin, İbrahim and Zoschke, K. and Tillack, B. (2013) Modeling and optimization of BiCMOS embedded through-silicon vias for RF-grounding. In: SIRF 2014, (Accepted/In Press)

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Item Type:Papers in Conference Proceedings
Subjects:T Technology > TK Electrical engineering. Electronics Nuclear engineering > TK7800-8360 Electronics
ID Code:22573
Deposited By:İbrahim Tekin
Deposited On:16 Jan 2014 12:44
Last Modified:16 Jan 2014 12:44

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