Items where Author is "Zhibo, C."

Papers in Conference Proceedings

Stocchi, M. and Wietstruck, M. and Schulze, S. and Zhibo, C. and Tolunay, S. and Kaynak, Mehmet (2020) Full-wave RF modeling of a fan-out wafer-level packaging technology based on Al-Al wafer bonding. In: IEEE 20th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF), San Antonio, TX, USA