Items where Author is "Yildiz, Orcun"
![[up]](/style/images/multi_up.png)
Up a levelGroup by: Item Type | No Grouping
Number of items: 1.
Yildiz, Orcun and Koşar, Ali (2025) A numerical study on die-integrated manifold microchannel heat sinks considering transistor-level heat dissipation of gan based mmic devices. In: ASME 2025 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2025), Anaheim, California, USA