Items where Author is "Schulze, S."

Papers in Conference Proceedings

Stocchi, M. and Wietstruck, M. and Schulze, S. and Zhibo, C. and Tolunay, S. and Kaynak, Mehmet (2020) Full-wave RF modeling of a fan-out wafer-level packaging technology based on Al-Al wafer bonding. In: IEEE 20th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF), San Antonio, TX, USA

Wietstruck, M. and Schulze, S. and Rebhan, B. and Kerepesi, P. and Kurz, H. and Silberer, G. and Meiler, J. and Tolunay Wipf, S. and Wipf, C. and Kaynak, Mehmet (2019) Al-Al direct bonding with sub-μm alignment accuracy for millimeter wave SiGe BiCMOS wafer level packaging and heterogeneous integration. In: IEEE 69th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA