Items where Author is "Rebhan, Bernhard"
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Papers in Conference Proceedings
Schulze, Sebastian and Wietstruck, Matthias and Fraschke, Mirko and Kerepesi, Peter and Kurz, Helmut and Rebhan, Bernhard and Kaynak, Mehmet (2019) Optimization of a BEOL aluminum deposition process enabling wafer level Al-Al thermo-compression bonding. In: IEEE 69th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA