Items where Author is "Rebhan, B."
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Wietstruck, M. and Schulze, S. and Rebhan, B. and Kerepesi, P. and Kurz, H. and Silberer, G. and Meiler, J. and Tolunay Wipf, S. and Wipf, C. and Kaynak, Mehmet (2019) Al-Al direct bonding with sub-μm alignment accuracy for millimeter wave SiGe BiCMOS wafer level packaging and heterogeneous integration. In: IEEE 69th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA