Items where Author is "Kurz, Helmut"
![[up]](/style/images/multi_up.png)
Up a levelGroup by: Item Type | No Grouping
Jump to: Papers in Conference Proceedings
Number of items: 1.
Papers in Conference Proceedings
Schulze, Sebastian and Wietstruck, Matthias and Fraschke, Mirko and Kerepesi, Peter and Kurz, Helmut and Rebhan, Bernhard and Kaynak, Mehmet (2019) Optimization of a BEOL aluminum deposition process enabling wafer level Al-Al thermo-compression bonding. In: IEEE 69th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA