Items where Author is "Bruno, Heusdens"
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Papers in Conference Proceedings
Zhibo, Cao and Pekkolay, Baran and Okur, Aslıhan and Bruno, Heusdens and Corrado, Carta and Mehmet, Kaynak (2023) An advanced finite element model of the Cu pillar solder reflow assembly. In: 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Graz, Austria