TSV-based antenna for on-chip wireless communication

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Pano, Vasil and Tekin, İbrahim and Liu, Yuqiao and Dandekar, Kapil R. and Taşkın, Barış (2020) TSV-based antenna for on-chip wireless communication. IET Microwaves, Antennas & Propagation, 14 (4). pp. 302-307. ISSN 1751-8725 (Print) 1751-8733 (Online)

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Abstract

On-chip wireless interconnects provide signal broadcasting and link shortcuts for improved latency and throughput, useful considering the increase of the number of processing elements on a chip. In this work, a through-silicon via antenna (TSV_A) for on-chip wireless communication is proposed. TSV_A significantly improves the wireless interconnect performance over current solutions of on-chip antennas, which occupy a large area of the chip and are not capable of far-reaching transmission. Printed circuit board (PCB) prototypes are designed and fabricated to validate the proposed TSV_A. The PCB prototype of the TSV_A has an insertion loss of 5-10 dB at a distance of similar or equal to 20 mm, measured in PCB and validated with high fidelity 3D finite element method simulation results. TSV_A has improved path loss, smaller size, and lower manufacturing costs due to the well-established TSV fabrication process for 3D-ICs. Projections for an on-chip 3D-IC operation indicate up to 40 dB improved signal strength compared to other on-chip antennas, with an insertion loss of similar or equal to 3-5 dB up to a 30 mm distance.
Item Type: Article
Uncontrolled Keywords: three-dimensional integrated circuits; finite element analysis; integrated circuit design; integrated circuit interconnections; wireless channels; mobile antennas; printed circuit design; TSV fabrication process; on-chip 3D-IC operation; TSV-based antenna; on-chip wireless communication; on-chip wireless interconnects; signal broadcasting; link shortcuts; wireless interconnect performance; printed circuit board prototypes; PCB prototype; 3D finite element method; through-silicon via antenna; size 20; 0 mm; size 30; 0 mm; loss 5; 0 dB to 10; 0 dB; loss 3; 0 dB to 5; 0 dB
Subjects: T Technology > TK Electrical engineering. Electronics Nuclear engineering > TK7800-8360 Electronics
Divisions: Faculty of Engineering and Natural Sciences > Academic programs > Electronics
Faculty of Engineering and Natural Sciences
Depositing User: İbrahim Tekin
Date Deposited: 17 Sep 2020 13:43
Last Modified: 17 Sep 2020 13:43
URI: https://research.sabanciuniv.edu/id/eprint/40215

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