Semi-intrinsic self-healing performance of liquid-cored microcapsules in epoxy matrix

Official URL: http://dx.doi.org/10.1002/adv.21802

We present an experimental study on the microcapsule‐based semi‐intrinsic self‐healing behavior of low viscosity epoxy resin used in Resin Transfer Molding (RTM) process. The microcapsules containing RTM epoxy resin are prepared using in situ polymerization of urea‐formaldehyde. Single type of microcapsules with six different agitation rates is prepared, resulting in microcapsules with a mean diameter ranging from 52 to 202 μm. The thermal characteristics of each microcapsule batch are investigated using Differential Scanning Calorimetry (DSC) and Simultaneous Thermal Analysis (STA). In addition to thermal characterization tools, Fourier Transform Infrared Spectroscopy (FTIR) is also used as a qualitative technique to determine the composition of microcapsules. The mechanical properties of the self‐healing specimen such as Mode‐I fracture toughness and flexure strength are assessed by a universal testing machine, and the obtained results are compared with the findings in literature.