Realization of low power, highly linear roic with current mode TDI for long wave infrared detectors

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Yazıcı, Melik (2010) Realization of low power, highly linear roic with current mode TDI for long wave infrared detectors. [Thesis]

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Abstract

Infrared (IR) imaging systems can be used for variety of civil and military applications such as medical imaging, surveillance, night vision and astronomy applications. In IR systems, readout electronic is a key element between detector and signal processing units. System performance parameters of readout electronic can be enumerated as follows: signal-to-noise ratio (SNR), linearity, input referred noise level and dynamic range. In this thesis, design of a CMOS readout integrated circuit (ROIC) for an array of 6x7 as a part of 576x7 full ROIC system, p-on-n type mercury cadmium telluride (HgCdTe) long wave infrared (LWIR) detectors is presented. AMS 0.35 μ[micro]m, 4-metal 2-poly CMOS process is used in the design of ROIC. Preamplifier of ROIC is direct injection(DI) type due to noise performance. In order to increase SNR, time delay integration (TDI) on 7 detectors is applied with a supersampling rate of three. TDI stage implemented as current mode with current memories rather than capacitances to store integrated charges. This particular novel current mode TDI design in this thesis brings superior features over other topologies like high linearity, low area and very low power consumption in comparison with capacitor based topologies. 99.9% linearity is achieved with 2.5 times smaller area with very low power consumption (28 μ[micro]W per channel) compared to other topologies. ROIC has additional features of bidirectional TDI scanning, programmable five gain settings, and programmable integration time by serial/parallel interface. ROIC operated at 1 MHz with an output dynamic range of 3.75V and input referred noise of 1000 rms electrons.
Item Type: Thesis
Uncontrolled Keywords: Readout integrated circuit (ROIC). -- Focal plane array (FPA). -- Scanning FPA. -- Time delay integration (TDI). -- Current mode. -- Infrared. -- Infrared cameras. -- Integrated circuits. -- Entegre okuma devresi (ROIC). -- Odaksal düzlem dizileri (FPA). -- Taramalı FPA. -- Zaman geciktirmeli toplama (TDI). -- Kızılötesi. -- Kızılötesi kameralar. -- Tümleşik devreler.
Subjects: T Technology > TK Electrical engineering. Electronics Nuclear engineering > TK7800-8360 Electronics
Divisions: Faculty of Engineering and Natural Sciences > Academic programs > Electronics
Faculty of Engineering and Natural Sciences
Depositing User: IC-Cataloging
Date Deposited: 17 Apr 2014 15:54
Last Modified: 26 Apr 2022 09:59
URI: https://research.sabanciuniv.edu/id/eprint/24143

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