Parametric study on the effect of endwalls on heat transfer and fluid flow in micro pin-fin heat sinks

Koz, Mustafa and Koşar, Ali (2008) Parametric study on the effect of endwalls on heat transfer and fluid flow in micro pin-fin heat sinks. In: ECI International Conference on Heat Transfer and Fluid Flow in Microscale, Whistler, BC, Canada

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Abstract

Micro pin-fin heat sinks have been considered as promising new generation micro heat sinks and may find applications in many fields such as aerospace, microreactor, electronics cooling, micro turbine cooling and microbiological applications. The knowledge of heat and fluid flow in such heat sinks is vital to design successful products and achieve high thermal-hydraulic performance. The flow in micro heat sinks can be considered as cross flow across intermediate size (based on the height-diameter ratio (H/D), H/D ratio changes from 1/2 to 5) micro heat sinks, whose thermal and hydraulic performances are different from long conventional pin fins due to the effects of endwalls on the both thermal and velocity boundary layers as well as low flow rates. The endwalls effects imposed by the microchannel having micro pin fins have not been extensively discussed in the literature since mostly long fins have been used in literature at high flow rates, where such effects were mostly negligible. This article intends to address the lack of information on endwalls effects on heat and fluid flow in micro pin fin heat sinks having intermediate size pin fins under broad working conditions (Reynolds number (1<Re<1000)) using water as working fluid.
Item Type: Papers in Conference Proceedings
Subjects: T Technology > TJ Mechanical engineering and machinery
T Technology > TA Engineering (General). Civil engineering (General)
Divisions: Faculty of Engineering and Natural Sciences > Academic programs > Mechatronics
Faculty of Engineering and Natural Sciences
Depositing User: Ali Koşar
Date Deposited: 14 Jan 2014 11:30
Last Modified: 26 Apr 2022 09:14
URI: https://research.sabanciuniv.edu/id/eprint/23610

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