A wafer bonded capacitive micromachined underwater transducer

Olcum, Selim and Oguz, Kagan and Muhammed Niyazi, Senlik and Yamaner, Yalçın Feysel and Bozkurt, Ayhan and Atalar, Abdullah and Koymen, Hayrettin (2009) A wafer bonded capacitive micromachined underwater transducer. In: 2009 IEEE International Ultrasonics Syposium, Rome, Italy (Accepted/In Press)

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In this work we have designed, fabricated and tested CMUTs as underwater transducers. Single CMUT membranes with different diameters and 380 microns of thickness are fabricated for the demonstration of an underwater CMUT element. The active area of the transducer is fabricated on top of a 3” silicon wafer. The silicon wafer is bonded to a gold electrode coated glass substrate wafer with 10cm in diameter. Thermally grown silicon oxide layer is used as the insulation layer between membrane and substrate electrodes. Electrical contacts and insulation are achieved using epoxy layers. Single CMUT elements are tested in air and in water. Approximately 40% bandwidth is achieved around 25 KHz with a single CMUT cell.

Item Type:Papers in Conference Proceedings
Subjects:T Technology > TK Electrical engineering. Electronics Nuclear engineering
ID Code:12841
Deposited By:Ayhan Bozkurt
Deposited On:20 Nov 2009 09:19
Last Modified:24 Jul 2019 09:19

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