Items where Author is "Fraschke, Mirko"

Papers in Conference Proceedings

Schulze, Sebastian and Wietstruck, Matthias and Fraschke, Mirko and Kerepesi, Peter and Kurz, Helmut and Rebhan, Bernhard and Kaynak, Mehmet (2019) Optimization of a BEOL aluminum deposition process enabling wafer level Al-Al thermo-compression bonding. In: IEEE 69th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA

Wietstruck, Matthias and Marschmeyer, Steffen and Kulse, Philipp and Vob, Thomas and Lisker, Marco and Krüger, Andreas and Wolansky, Dirk and Fraschke, Mirko and Kaynak, Mehmet (2018) Development of a through-silicon via (TSV) process module for multi-project wafer SiGe BiCMOS and silicon interposer. In: IEEE 68th Electronic Components and Technology Conference (ECTC), San Diego, CA, USA