A77 GHz on-chip dipole antenna with etched silicon substrate

Seyyedesfahlan, Mirmehdi and Kaynak, Mehmet and Tekin, İbrahim (2012) A77 GHz on-chip dipole antenna with etched silicon substrate. In: Memswave 2012, (Accepted/In Press)

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In this paper, a 77 GHz microstrip dipole antenna is integrated on a layered 11.4 m SiO2 and a silicon substrate with thickness of 670 m. The unbalanced microstrip line is balanced by using a lumped LC circuit balun to feed both of the dipole arms. To decrease the substrate loss and hence increase the antenna gain, Localized Backside Etch (LBE) module offered by IHP is utilized to etch the area under the dipole antenna. For mechanical robustness, two walls of silicon substrate are left at the end of the dipole arms inside the etched area. The simulation results show a 3.2 dBi gain and 15 GHz bandwidth at 77 GHz.

Item Type:Papers in Conference Proceedings
Subjects:T Technology > TK Electrical engineering. Electronics Nuclear engineering > TK7800-8360 Electronics
ID Code:19955
Deposited By:İbrahim Tekin
Deposited On:06 Nov 2012 22:45
Last Modified:31 Jul 2019 14:06

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