Items where Author is "Inac, M."
The system is temporarily closed to updates for reporting purpose. |
Papers in Conference Proceedings
Inac, M. and Wietstruck, M. and Goritz, A. and Cetindogan, B. and Baristiran-Kaynak, C. and Lisker, M. and Kruger, A. and Trusch, A. and Saarow, U. and Heinrich, P. and Voss, T. and Kaynak, Mehmet (2018) Oxide surface roughness optimization of BiCMOS beol wafers for 200 mm wafer level microfluidic packaging based on fusion bonding. In: IEEE 19th Electronics Packaging Technology Conference (EPTC), Singapore
Wietstruck, M. and Marschmeyer, S. and Lisker, M. and Kruger, A. and Wolansky, D. and Fraschke, M. and Kulse, P. and Goritz, A. and Inac, M. and Voss, T. and Mai, A. and Kaynak, Mehmet (2018) Through-Silicon Via process module with backside metallization and redistribution layer within a 130 nm SiGe BiCMOS technology. In: IEEE 19th Electronics Packaging Technology Conference (EPTC), Singapore