Self-assembly of high performance on-chip RF-MEMS inductors using internal stress

Bajwa, Rayan and Kaya Yapıcı, Murat (2018) Self-assembly of high performance on-chip RF-MEMS inductors using internal stress. In: 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Toulouse, France

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Official URL: http://dx.doi.org/10.1109/EuroSimE.2018.8369888


This work reports on the design of three-dimensional, on-chip RF-MEMS inductors based on self-assembly using residual stress in thin films. We show internal stress-based self-assembly of patterned thin films into single and multiple-turn vertical inductors with spiral and solenoid geometry, and verify performance improvement using coupled multi-physics simulation tools. Structures after transverse bending display high g-factor and high self-resonance frequency as compared to inductor configurations in planar geometry with the same turn-density. Simulation results indicate that, performance increase of approximately 200% in Q-factor and∼ 41% in resonance frequency can be achieved for single-turn ring inductors, while Q-factor and resonance frequency values were doubled for multiple-turn spiral inductors upon vertical self-assembly.

Item Type:Papers in Conference Proceedings
ID Code:36187
Deposited By:Murat Kaya Yapıcı
Deposited On:14 Aug 2018 14:16
Last Modified:14 Aug 2018 14:16

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