title   
  

A compact nanostructure enhanced heat sink with flow in a rectangular channel

Şeşen, Muhsincan and Koşar, Berkay Arda and Koşar, Ali and Khudhayer, Wisam and Ahıshalıoğlu, Berk Ahmet and Karabacak, Tansel (2010) A compact nanostructure enhanced heat sink with flow in a rectangular channel. In: 10th ASME Biennial Conference on Engineering Systems Design and Analysis, Yeditepe University, Istanbul, Turkey

This is the latest version of this item.

Full text not available from this repository.

Abstract

This paper reports a compact nanostructure based heat sink. The system has an inlet and an outlet valve similar to a conventional heat sink. From the inlet valve, pressurized deionized-water is propelled into a rectangular channel (of dimensions 24mmx59mmx8mm). This rectangular channel houses a nanostructured plate, on which similar to 600 nm long copper nanorod arrays with an average nanorod diameter of 150 nm are integrated to copper thin film coated on silicon wafer surface. Forced convective heat transfer characteristics of the nanostructured plate are investigated using the experimental setup and compared to the results from a flat plate of copper thin film deposited on silicon substrate. Nanorod arrays act as fins over the plate which enhances the heat transfer from the plate. Excess heat generating small devices are mimicked through a small heat generator placed below the nanostructured plate. Constant heat flux is provided through the heat generator. Thermocouples placed on the heater surface are utilized to gather the surface temperature data. Constant pressure drop across the heat sink and constant heat flux values are varied in order to obtain the correlation between heat removal rate and input power. Volumetric flow rate was measured as a function of the constant pressure drop. In this study, it was proved that nanostructured surfaces have the potential to be a useful in cooling of small and excessive heat generating devices such as MEMS (Micro Electro Mechanical Systems) and micro-processors.

Item Type:Papers in Conference Proceedings
Subjects:T Technology > TJ Mechanical engineering and machinery
Q Science > QC Physics > QC1 General
ID Code:16558
Deposited By:Ali Koşar
Deposited On:14 Jun 2011 14:11
Last Modified:14 Jun 2011 14:11

Available Versions of this Item

Repository Staff Only: item control page